Resume 9

OBJECTIVE

RF/Optical/High-Speed-Analog Engineering position requiring high-frequency/low-noise/broadband hardware design and/or RF system level definition

Master of Science in Electrical Engineering/Minor in Mathematics, Washington State University WSU , August 1993, Grade Point Average GPA 3.89 of 4.0, Specialized in Electromagnetics and Semiconductor Theory
Bachelor of Science in Electrical Engineering, WSU December 1989, GPA 3.56 of 4.0, Cum Laude, Four "Presidential Honors" for high GPA levels

• Responsible for design of transmitters/receivers ranging in data rates from 125 Mb/s to 2.5 Gb/s.

• Data channel receivers utilized InGaAs Indium Gallium Arsenide and silicon APD s Avalanche Photo Diodes with sensitivities in the range of -48 dBm for 125 Mb/s data and -38 dBm for 1.25 Gb/s data optical power levels .

• APD receivers required high voltage circuit design 60 volts for 1550 nm to 200 volts for 800 nm with temperature compensation.

• Another low frequency receiver design utilized a germanium "quad" cell for purposes of tracking and alignment of the system optical transceiver heads; this design utilized an extremely low noise amplifier chain with AGC Automatic Gain Control .

• Transmitter designs utilized Fujitsu/Agere DFB Distributed Feedback lasers in butterfly package feeding an EDFA Erbium Doped Fiber Amplifier amplifier.

• Filed a patent application entitled "Switched Optical Detector Tracking For Wireless Optical Communication Systems".

• High power 200 mW s laser driver design for OC-3 155 Mb/s utilized an Infineon fiber-coupled laser, three stages of amplification NEC NE46134 s and PolyFet P123 high current stage , and a PIN diode attenuator Agilent HSMP-3814 PIN diodes ; was able to achieve less than 1 ns rise/fall times with a 500 milliamp swing.

• Agilent 86130A BERT Bit Error Rate Tester and Agilent 86100A [sampling scope with O/E Optical/Electrical and differential TDR Time Domain Reflectometer sub-modules] formed the heart of my test bench along with Agilent spectrum analyzer and 8753E network analyzer.

• Agilent ADS Advanced Design System simulation software was utilized extensively throughout employment with Terabeam.

• Responsible for next generation 2.5 Gigabit/s data rate, 100 picosecond rise/fall times fiber optic transceiver development utilizing VCSEL Vertical Cavity Surface Emitting Laser multimode, 850 nm wavelength transmitter, high frequency optoelectric PIN diode receiver assemblies, 2.5 Gb/s GaAs Serializer/Deserializer chips.

• Project involves extensive use of the following software/hardware tools: Agilent ADS software, high frequency SPICE simulations, PADS schematic/PCB layout software, Hewlett Packard 3.2 Gigabit/s jitter analysis system including BERT Bit Error Rate Tester , Agilent 83480 high speed sampling scope 20 GHz front end bandwidth with 83487A 2.8 GHz optical/electrical converter plug-in and HP54751A TDR plug-in, Advantest optical power meter, JDS Fitel optical attenuator.

• Eye diagram analysis, BER analysis 10e-12 BER goal , jitter analysis are the mainstay performance indicators.

• Also, high speed 3.2 Gb/s, 100 picosecond rise/fall times backplane design for high port-count Fibre Channel switch.

• Backplane design requires:

  1. extensive modeling of vias, couplers, connectors, transmission line geometries with HFSS High Frequency Structure Simulator software from both Ansoft version 7.0 and Agilent version 5.5
  2. high frequency SPICE-like simulations using Agilent ADS software
  3. evaluation of high speed connectors from Teradyne VHDM and HSD , AMP HS3 , Siemens SpeedPac , FCI/Berg Metral .

Involved with "skunkworks" GSM Smart Antenna system effort. Project included travel to the U.K. for training/consulting time with a GSM organization called MAC Multiple Access Communications . Responsible for system RX and TX RF Hardware development including the following:

• RX side RF switch matrix four RF inputs and 12 RF outputs with drop-in, all surface-mount RF components M/A Com LNA s, Alpha splitters/digital attenuators/GaAs switches for operation in either the EGSM, DCS-1800, or PCS-1900 frequency bands. Design included the following: an Altera EPF10K20 programmable logic device for control of all switching functions in accordance with the GSM TDMA format, a pilot tone and RF detector circuitry for path integrity checks, digital attenuators on all RF paths for path gain balance to within 0.5 dB. The entire receive side noise figure, gain, and intercept point were set by this design. 12 layer FR-4 PCB.

• "uplink" scan receiver essentially a "narrowband, IF-digitized" digital receiver with drop-in RF components for all three frequency bands mentioned above. The receiver chain consists of a single down-convert to a 200 kHz BW SAW filter center frequency of 199 MHz and then into a high speed A-to-D converter Analog Devices AD6600, encode rate = 13MHz . After the AD6600 was an Analog Devices "decimating receiver" AD6620 . The AD6620 contains a numerically controlled oscillator, which performs a second down-conversion, and then three stages of digital filtering at base-band for extreme rejection of GSM "blocker" signals. The design also included PLL design centered around the National Semiconductor LMX2320 synthesizer chip and a M/A Com VCO for good phase noise performance. 8 layer FR-4 construction. ETSI GSM 5.05 specification guiding design.

• "downlink" scan receiver design for monitoring communications from the TX ports of the GSM base station transceivers. Essentially the design mimics a mobile phone by utilizing half of the Analog Devices GSM chip set ADmsp415 chip set . Design included the National Semiconductor LMX2331A dual synthesizer chip, Analog Devices AD6459 IF subsystem chip mixer, amplifier, I and Q demodulators, etc. , and an Analog Devices AD6421 chip half of the ADmsp415 chip set . This design provided GSM timing and control channel information to the "downlink processor board" of our system.

• TX combiner board. This board s function is to combine four 40 watt RF signals 925-960 MHz from GSM base station TX ports. Very simple from a schematic standpoint but more difficult from a heat dissipation and mechanical standpoint. The board utilized Anaren 3 dB Xingers and 6 dB couplers, RF Power Components, Inc. 100 watt and 150 watt "waste" loads, Rogers 4350 low loss dielectric substrate, AMP 2mm Hard Metric style backplane connectors and a massive heat sink approximately 10" by 16" for heat dissipation from the "waste" loads. Single layer microstrip construction. Worked with Mechanical Engineers to define heatsink.

• TX side switch matrix and high power attenuator project 925 to 960 MHz . This design built upon previously developed prototypes and utilized two versions of M/A Com high power PIN diodes for transmission/attenuation of up to 40 watt RF signals. The design consisted of two SP5T single pole five throw switches and two high power attenuators DAC voltage control , controlled by an Altera EPM7256A programmable logic device. The SP5T s were very frequency sensitive, requiring l/2 and l/4 sections and judiciously placed tuning stubs for tuning out diode and other surface mount component parasitics. Design also required a switching power supply, centered around Linear Technologies "ultra-quiet" LT1533 chip, to go from +24 VDC to -75 VDC for high reverse bias of PIN diodes. Measurements were made on a prototype, RF modelling was performed using Ansoft Serenade software and schematic entry was completed. Layout for this design was to begin in April.

RF Engineer developing Metawave s "Spotlight" Analog Smart Antenna product for the AMPS/NAMPS cellular bands. Designs included the following:

• receive-side RF switch matrix 12 RF in s/16 RF out s, 824-849 MHz . Several splitter/LNA/attenuator/GaAs switch sections to preserve system noise figure, gain, and IP3 of the entire RX RF chain of the "Spotlight" Smart Antenna product. 12 layer FR-4 PCB.

• transmit-side RF switch matrix 869-894 MHz . Three stages of M/A Com RF digital attenuators on each path for accurate control of transmit side power levels. 12 layer FR-4 construction. 1 watt input levels. 12 RF in s and 16 RF out s. Berg style RF connectors.

• AMPS/NAMPS RF "scan" receiver 824-849 MHz, dual down-conversion design consisting of Triquint front end LNA/mixer, Philips SA625 IF subsystem chip, TOKO SAW filter at IF, and Philips SA7025 fractional-N synthesizer. Met IS-95 specifications for RF performance adjacent/alternate channel rejection performance, intermodulation performance, sensitivity performance, etc. . < 2ms RSSI scanning capability.

International Sensor Technology is a small, family-owned business originating from PhD s Laser-Heated Thermoluminescent Dosimetery LHTLD patent; Naval contract to deliver ship and shore radiation badge "readers":

• The system used SYNRAD CO2 lasers to locally heat an irradiated phosphor personnel dosimeter ; the heated phosphor would emit photons with photon density proportional to the radiation level; a high voltage photomultiplier tube gathered the photons and translated them into electronic pulses for dosimeter dosage measurement

• I was responsible for electronic debug, calibration, troubleshooting, and accuracy testing of both ship and shore systems

• This position required grading course-work/exams, supervising laboratory experiments, giving course lectures, research in non-linear MOSFET characteristics, one-on-one tutoring of students in courses covering Electromagnetics, Control Theory, Digital circuits.

• The position was with the Electrical Engineering Department and covered educational costs associated with my Master s degree as well as providing a salary.

• Worked in the Acoustics Division of NUWES for first year. Lead Engineer on the Noise Reduction System 4 NRS4 which was responsible for gathering torpedo acoustic signatures. The system incorporated "hydrophones" underwater transducers and all of the on-ship electronics to record torpedo acoustic data. Responsibilities included system calibration, recording torpedo "shots" on the Dabob range and the Canadian Quinault range, troubleshooting, system and system documentation upkeep

• Worked in the Heavy Weapons Division for last six months. Duties included Torpedo cable manufacture, cable repair, cable damage investigation, and automated cable test set development.

• Started at GS-7 ranking and obtained GS-11 ranking within 1.5 years. Duties required "Secret" security clearance level

Assisted Senior Engineers with various projects, incorporated schematic revisions, put together project instructions to be issued to technicians, estimated cost of materials for two fairly large projects, monitoring of transformer current and voltage levels throughout Boeing complex, put together plans for installation of 60 Hz power.

• Anritsu 3.2 Gb/s BERT Bit Error Rate Tester
• HP 3.2 Gb/s Jitter Analysis system
• HP8510/HP8753E/HP8714 vector network analyzers
• Rohde & Schwarz FSEB20 spectrum analyzer with low phase noise option and vector analysis option for demodulation of GMSK signal, eye diagrams, constellations, etc.
• HPE4419B dual power meter
• HP frequency and modulation domain analyzer for testing PLL step response
• HP8595E spectrum analyzer with noise figure/phase noise personality cards
• HP8644B ultra pure signal generator phase noise = -136 dBc/Hz @ 20 kHz offset
• used for GSM "blocker" testing of "uplink" receiver
• Fluke 6060 and HP8657B series signal generators
• 20 GHz Tektronix TDR Time Domain Reflectometer
• HP8921/IFR communications test sets for AMP/NAMPS receiver performance measurements
• HP portable Logic Analyzer for PLD troubleshooting.

• Ansoft Serenade version 7.5 full linear and nonlinear RF analysis
• Ansoft HFSS HFSS=High Frequency Structure Simulator
• finite element method 3-D electromagnetic solver for analysis of via structures in multi-layer PCB s and stripline/microstrip propagation
• Agilent ADS with "Momentum" Planar Field Solver
• Agilent HFSS version 5.5
• HP Series IV Omnisys for system level RF gain, noise figure, and IP3 budgets
• MMICAD linear RF simulator
• MATLAB
• Protel 99 for schematic entry and PCB layout
• Orcad schematic entry
• PADS schematic/layout
• EZNEC antenna analysis Method Of Moments software
• Microsim PSPICE for digital simulations and low frequency VCO design
• Altera MAX+II design tools for PLD Programmable Logic Device design.

• LPKF PCB milling machine training for their C60 style milling machine 4 mil traces/4 mil spacing , CTIA trade show, DesignCon 2000, Ansoft Eminence HFSS 4 day training course
• Ansoft Serenade version 8.0 training course
• HP Series IV Omnisys RF systems analysis 4 day training course
• Les Besser RF Techniques II
• 5 day GSM training course\consultation held in South Hampton, England.

Used experimental data to solve for the electric/magnetic constitutive parameters of many materials including a sample of carbon-fiber impregnated material used on the Boeing 777 aircraft. The project required the use of a HP 8510 network analyzer in the X-band and iterative Newton-Raphson techniques to solve for the variables of the "reflection/transmission" technique found in the literature.

• Modeling of electron velocity and electron scattering processes in GaAs. The GaAs model assumed multiple valleys E-k plot and covered inter- and intra-valley scattering processes involving phonon/photon and other particle collision effects. Fortran coding required sparse matrix techniques, tri-diagonal solvers, scattering process PDF characterization, Monte Carlo simulation and a CRAY computer account. Velocity vs. E-field results from the model closely matched literature results.

• charge transport in silicon model required discretizing continuity equation, Poisson s equation, and other differential equations on a "mesh"; used Fortran language and sparse matrix techniques.

• Attended every Electromagnetics courses which WSU had to offer. Topics covered include: diffraction mathematics, microwave/atmospheric propagation, waveguide analysis, optics holography and 2D spatial Fourier transforms , fiber-optic mode solutions, Near/Far field antenna analysis, solving for diffraction fields from knife-edge, solving for radar cross sections of canonical geometries, use of iterative techniques for solving electromagnetic problems, complex variable mapping.

• VLSI Course VLSI chip design 2 mm process, 1989 using Mentor Graphics software, SPICE modeling, and very dense D Flip-Flop architecture. VLSI chip function was "pattern-recognition" of a digital vector.

• Microwave amplifier and filter design designed with Touchstone and microstrip; hands-on in WSU s Microwave laboratory.

• Fabricated simple Schottky diodes in WSU s "clean" room as part of graduate-level semiconductor course.